词语屋>英语词典>solder翻译和用法

solder

英 [ˈsəʊldə(r)]

美 [ˈsɑːdər]

n.  焊料; 焊锡
v.  焊接; 焊合

过去分词:soldered 现在分词:soldering 复数:solders 第三人称单数:solders 过去式:soldered 

TOEFLGRE

BNC.24210 / COCA.24452

牛津词典

    noun

    • 焊料;焊锡
      a mixture of metals that is heated and melted and then used to join metals, wires, etc. together

      verb

      • 焊接;焊合
        to join pieces of metal or wire with solder

        柯林斯词典

        • VERB 焊;焊接;焊合
          If yousoldertwo pieces of metal together, you join them by melting a small piece of soft metal and putting it between them so that it holds them together after it has cooled.
          1. Fewer workers are needed to solder circuit boards...
            焊接电路板需要的工人更少了。
          2. He then soldered the wire to the telephone terminal...
            接着他把电话线焊接到电话机上。
          3. He cuts the pieces and solders them together.
            他把那些断片切碎,然后把它们焊在一起。
        • 焊料;焊锡
          Solderis the soft metal used for soldering.

          英英释义

          noun

          • an alloy (usually of lead and tin) used when melted to join two metal surfaces

            verb

            • join or fuse with solder
              1. solder these two pipes together

            双语例句

            • This course covers the detailed material considerations required for achieving high reliability for lead-free solder joints.
              此课程涵盖了高可靠无铅焊点、材料选择的详细要求。
            • Fewer workers are needed to solder circuit boards
              焊接电路板需要的工人更少了。
            • Effect of Alloying Elements and Aging on Microstructure and Solder Interface of Sn-Zn Lead-free Solders
              合金元素及时效处理对Sn-Zn无铅钎料组织和钎焊界面的影响
            • Quality problem and solution on lead-free solder was reviewed.
              并对无铅焊接特有的质量问题及解决方法进行了评述。
            • A new method for the simultaneous dissolution and determination of tin and silver in copper solder was reported.
              提出了简单、快速地同时溶解及测定铜基锡银焊料中锡银的新方法。
            • Resistance diffusing soldering of copper and mild steel Static contact Electrode shape Inserting solder Potential difference;
              铜与低碳钢电阻扩散焊;静触头;电极形状;嵌料;电位差;
            • The interconnection between sensor and substrate was realized by molten solder droplet bonding in this study, and the joint configuration, forming process and microstructure were analyzed.
              本文利用钎料熔滴键合方法实现了传感器与基板焊盘之间的互连,对这种工艺下的接头形态、接头的形成过程及微观组织特征进行了研究。
            • Wettability of Sn-Zn, Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate
              Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性
            • When installing solder end valves, conventional soldering techniques should be used.
              安装焊接连接端口的阀门时,应该采用普通焊接技术。
            • Therefore, to improve the reliability of solder joints is one of the most important tasks for electronic industry.
              因此提高焊点的可靠性及寿命是电子业界相当重要的一个课题,故本研究也将朝这方面去执行。